完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Meng Hsin-Fei | en_US |
dc.contributor.author | Lin Hao-Wu | en_US |
dc.contributor.author | Horng Sheng-Fu | en_US |
dc.contributor.author | Zan Hsiao-Wen | en_US |
dc.contributor.author | Chang Hao-Wen | en_US |
dc.contributor.author | Chang Yu-Fan | en_US |
dc.contributor.author | Chiu Yu-Chian | en_US |
dc.date.accessioned | 2014-12-16T06:13:51Z | - |
dc.date.available | 2014-12-16T06:13:51Z | - |
dc.date.issued | 2014-05-13 | en_US |
dc.identifier.govdoc | H01L051/40 | zh_TW |
dc.identifier.uri | http://hdl.handle.net/11536/104383 | - |
dc.description.abstract | A method for manufacturing an organic electronic component is provided. The method includes steps of providing a substrate and an organic material; coating the organic material onto the substrate; heating the substrate to form a first carrier transport layer; doping a material having a metal ion to an organic solvent to form an organic solution; and applying the organic solution onto the first carrier transport layer to form a second carrier transport layer. | zh_TW |
dc.language.iso | zh_TW | en_US |
dc.title | Method for manufacturing organic electronic component having salt compound | zh_TW |
dc.type | Patents | en_US |
dc.citation.patentcountry | USA | zh_TW |
dc.citation.patentnumber | 08722454 | zh_TW |
顯示於類別: | 專利資料 |