標題: | Coaxial transitions for CPW-to-CPW flip chip interconnects |
作者: | Wu, W. C. Chang, E. Y. Huang, C. H. Hsu, L. H. Starski, J. P. Zirath, H. 材料科學與工程學系 Department of Materials Science and Engineering |
公開日期: | 16-八月-2007 |
摘要: | A novel coaxial transition for CPW-to-CPW flip chip interconnect is presented and experimentally demonstrated. To realise the coaxial transition on the CPW circuit, benzocyclobutene was used as the interlayer dielectric between the vertical coaxial transition and the CPW circuit. The coaxial interconnect structure was successfully fabricated and RF characterised to 67 GHz. The structure showed excellent interconnect performance from DC up to 55 GHz with low return loss below 20 dB and low insertion loss less than 0.5 dB even when the underfill was applied to the structure. |
URI: | http://dx.doi.org/10.1049/el:20071696 http://hdl.handle.net/11536/10439 |
ISSN: | 0013-5194 |
DOI: | 10.1049/el:20071696 |
期刊: | ELECTRONICS LETTERS |
Volume: | 43 |
Issue: | 17 |
起始頁: | 929 |
結束頁: | 930 |
顯示於類別: | 期刊論文 |