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dc.contributor.authorChang Edward Yien_US
dc.contributor.authorHsiao Yu-Linen_US
dc.contributor.authorLu Jung-Chien_US
dc.date.accessioned2014-12-16T06:13:59Z-
dc.date.available2014-12-16T06:13:59Z-
dc.date.issued2013-09-17en_US
dc.identifier.govdocH01L033/30zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/104444-
dc.description.abstractThe present invention provides a method for forming a multilayer substrate having a gallium nitride layer, wherein a mesh layer having a plurality of openings is formed on a substrate, and a buffer layer, three aluminum gallium nitride layers with different aluminum concentrations and a gallium nitride layer are formed in sequence on the substrate in the openings. The three aluminum gallium nitride layers with different aluminum concentrations are capable of releasing stress, decreasing cracks on the surface of the gallium nitride layer and controlling interior defects, such that the present invention provides a gallium nitride layer with larger area, greater thickness, no cracks and high quality for facilitating the formation of high performance electronic components in comparison with the prior art. The present invention further provides a multilayer substrate having a gallium nitride layer.zh_TW
dc.language.isozh_TWen_US
dc.titleMultilayer substrate having gallium nitride layer and method for forming the samezh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber08536616zh_TW
Appears in Collections:Patents


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