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dc.contributor.authorChang Yien_US
dc.contributor.authorChang Chia-Huaen_US
dc.contributor.authorLin Yueh-Chinen_US
dc.date.accessioned2014-12-16T06:14:02Z-
dc.date.available2014-12-16T06:14:02Z-
dc.date.issued2013-04-16en_US
dc.identifier.govdocH01L021/00zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/104491-
dc.description.abstractA method for fabricating a GaN-based thin film transistor includes: forming a semiconductor epitaxial layer on a substrate, the semiconductor epitaxial layer having a n-type GaN-based semiconductor material; forming an insulating layer on the semiconductor epitaxial layer; forming an ion implanting mask on the insulating layer, the ion implanting mask having an opening to partially expose the insulating layer; ion-implanting a p-type impurity through the opening and the insulating layer to form a p-doped region in the n-type GaN-based semiconductor material, followed by removing the insulating layer and the ion implanting mask; forming a dielectric layer on the semiconductor epitaxial layer; partially removing the dielectric layer; forming source and drain electrodes; and forming a gate electrode.zh_TW
dc.language.isozh_TWen_US
dc.titleMethod for fabricating a GaN-based thin film transistorzh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber08420421zh_TW
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