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dc.contributor.authorChangen_US
dc.contributor.authorChun-Yenen_US
dc.date.accessioned2014-12-16T06:14:20Z-
dc.date.available2014-12-16T06:14:20Z-
dc.date.issued2011-04-19en_US
dc.identifier.govdocH01L029/06zh_TW
dc.identifier.govdocH01L031/00zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/104671-
dc.description.abstractThe present invention is related to a semiconductor device with group III-V channel and group IV source-drain and a method for manufacturing the same. Particularly, the energy level density and doping concentration of group III-V materials are increased by the heteroepitaxy of group III-V and group IV materials and the structural design of elements. The method comprises: preparing a substrate; depositing a dummy gate material layer on the substrate and defining a dummy gate from the dummy gate material layer by photolithography; performing doping by self-aligned ion implantation using the dummy gate as a mask and performing activation at high temperature, so as to form source-drain; removing the dummy gate; forming a recess in the substrate between the source-drain pair by etching; forming a channel-containing stacked element in the recess by epitaxy; and forming a gate on the channel-containing stacked element.zh_TW
dc.language.isozh_TWen_US
dc.titleSemiconductor device with group III-V channel and group IV source-drain and method for manufacturing the samezh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber07928427zh_TW
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