METHOD FOR MANUFACTURING ORGANIC ELECTRONIC COMPONENT HAVING SLAT COMPOUND

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DC 欄位	值	語言
dc.contributor.author	MENG Hsin-Fei	en_US
dc.contributor.author	Lin Hao-Wu	en_US
dc.contributor.author	Horng Sheng-Fu	en_US
dc.contributor.author	Zan Hsiao-Wen	en_US
dc.contributor.author	Chang Hao-Wen	en_US
dc.contributor.author	Chang Yu-Fan	en_US
dc.contributor.author	Chiu Yu-Chian	en_US
dc.date.accessioned	2014-12-16T06:14:50Z	-
dc.date.available	2014-12-16T06:14:50Z	-
dc.date.issued	2014-02-13	en_US
dc.identifier.govdoc	H01L051/40	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/104956	-
dc.description.abstract	A method for manufacturing an organic electronic component is provided. The method includes steps of providing a substrate and an organic material; coating the organic material onto the substrate; heating the substrate to form a first carrier transport layer; doping a material having a metal ion to an organic solvent to form an organic solution; and applying the organic solution onto the first carrier transport layer to form a second carrier transport layer.	zh_TW
dc.language.iso	zh_TW	en_US
dc.title	METHOD FOR MANUFACTURING ORGANIC ELECTRONIC COMPONENT HAVING SLAT COMPOUND	zh_TW
dc.type	Patents	en_US
dc.citation.patentcountry	USA	zh_TW
dc.citation.patentnumber	20140045298	zh_TW
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