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dc.contributor.authorCHEN KUAN-NENGen_US
dc.contributor.authorKO CHENG-TAen_US
dc.contributor.authorLO WEI-CHUNGen_US
dc.date.accessioned2014-12-16T06:14:52Z-
dc.date.available2014-12-16T06:14:52Z-
dc.date.issued2014-01-02en_US
dc.identifier.govdocH01L033/62zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/104967-
dc.description.abstractA heterostructure containing IC and LED and a method of fabricating. An IC and an LED are established with the IC having a first electric-conduction block and a first connection block. The IC electrically connects to the first electric-conduction block. A first face of the LED has a second electric-conduction block and a second connection block. The LED is electrically connected to the second electric-conduction block. The first electric-conduction block and the first connection block are respectively joined to the second electric-conduction block and the second connection block, and the first electric-conduction block are electrically connected with the second electric-conduction block to form a heterostructure. The heterostructure provides functions of heat radiation and electric communication for IC and LED.zh_TW
dc.language.isozh_TWen_US
dc.titleHETEROSTRUCTURE CONTAINING IC AND LED AND METHOD FOR FABRICATING THE SAMEzh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber20140004630zh_TW
Appears in Collections:Patents


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