Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | CHEN KUAN-NENG | en_US |
dc.contributor.author | KO CHENG-TA | en_US |
dc.contributor.author | LO WEI-CHUNG | en_US |
dc.date.accessioned | 2014-12-16T06:15:03Z | - |
dc.date.available | 2014-12-16T06:15:03Z | - |
dc.date.issued | 2012-12-13 | en_US |
dc.identifier.govdoc | H01L033/62 | zh_TW |
dc.identifier.govdoc | H01L033/48 | zh_TW |
dc.identifier.uri | http://hdl.handle.net/11536/105102 | - |
dc.description.abstract | A heterostructure contains an IC and an LED. An IC and an LED are initially provided. The IC has at least one first electric-conduction block and at least one first connection block. The IC electrically connects with the first electric-conduction block. The first face of the LED has at least one second electric-conduction block and at least one second connection block. The LED electrically connects to the second electric-conduction block. Subsequently, the first electric-conduction block and the first connection block are respectively joined to the second electric-conduction block and the second connection block. The first electric-conduction block is electrically connected with the second electric-conduction block and forms a heterostructure. The system simultaneously provides functions of heat radiation and electric communication for the IC and LED resulting in a high-density, multifunctional heterostructure. | zh_TW |
dc.language.iso | zh_TW | en_US |
dc.title | HETEROSTRUCTURE CONTAINING IC AND LED AND METHOD FOR FABRICATING THE SAME | zh_TW |
dc.type | Patents | en_US |
dc.citation.patentcountry | USA | zh_TW |
dc.citation.patentnumber | 20120313133 | zh_TW |
Appears in Collections: | Patents |
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