完整後設資料紀錄
DC 欄位語言
dc.contributor.authorCHEN KUAN-NENGen_US
dc.contributor.authorKO CHENG-TAen_US
dc.contributor.authorLO WEI-CHUNGen_US
dc.date.accessioned2014-12-16T06:15:03Z-
dc.date.available2014-12-16T06:15:03Z-
dc.date.issued2012-12-13en_US
dc.identifier.govdocH01L033/62zh_TW
dc.identifier.govdocH01L033/48zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/105102-
dc.description.abstractA heterostructure contains an IC and an LED. An IC and an LED are initially provided. The IC has at least one first electric-conduction block and at least one first connection block. The IC electrically connects with the first electric-conduction block. The first face of the LED has at least one second electric-conduction block and at least one second connection block. The LED electrically connects to the second electric-conduction block. Subsequently, the first electric-conduction block and the first connection block are respectively joined to the second electric-conduction block and the second connection block. The first electric-conduction block is electrically connected with the second electric-conduction block and forms a heterostructure. The system simultaneously provides functions of heat radiation and electric communication for the IC and LED resulting in a high-density, multifunctional heterostructure.zh_TW
dc.language.isozh_TWen_US
dc.titleHETEROSTRUCTURE CONTAINING IC AND LED AND METHOD FOR FABRICATING THE SAMEzh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber20120313133zh_TW
顯示於類別:專利資料


文件中的檔案:

  1. 20120313133.pdf

若為 zip 檔案,請下載檔案解壓縮後,用瀏覽器開啟資料夾中的 index.html 瀏覽全文。