完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | CHEN Fang-Chung | en_US |
dc.contributor.author | Chuang Ming-Kai | en_US |
dc.date.accessioned | 2014-12-16T06:15:13Z | - |
dc.date.available | 2014-12-16T06:15:13Z | - |
dc.date.issued | 2012-05-10 | en_US |
dc.identifier.govdoc | H01L051/56 | zh_TW |
dc.identifier.govdoc | H01L051/40 | zh_TW |
dc.identifier.govdoc | H01L051/48 | zh_TW |
dc.identifier.uri | http://hdl.handle.net/11536/105184 | - |
dc.description.abstract | Disclosed is a manufacturing method for an organic optoelectronic thin film comprising the steps of providing a substrate and a first electrode; forming a semiconductor layer on the substrate, wherein the semiconductor layer includes polyethylene glycol (PEG); forming a conductive polymer layer on the first electrode; disposing the substrate and the semiconductor layer on the conductive polymer layer and adhering the semiconductor layer to the conductive polymer layer; and removing the substrate; and forming a second electrode on the semiconductor layer. A first adhesion between the semiconductor layer and the substrate is generated. A second adhesion between the semiconductor layer and the conductive polymer layer is generated. The second adhesion is greater than the first adhesion so that while the substrate is removed, the semiconductor layer and the conductive polymer layer are still adhered. | zh_TW |
dc.language.iso | zh_TW | en_US |
dc.title | MANUFACTURING METHOD FOR ORGANIC OPTOELECTRONIC THIN FILM | zh_TW |
dc.type | Patents | en_US |
dc.citation.patentcountry | USA | zh_TW |
dc.citation.patentnumber | 20120115266 | zh_TW |
顯示於類別: | 專利資料 |