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dc.contributor.author張榮原en_US
dc.contributor.author陳富強en_US
dc.date.accessioned2014-12-16T06:15:24Z-
dc.date.available2014-12-16T06:15:24Z-
dc.date.issued2013-09-01en_US
dc.identifier.govdocH03H007/46zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/105275-
dc.description.abstract本發明為一種新型微波電路之設計,此微波電路稱為三頻雙工環路器,其亦基於後設材料之電磁帶隙性質所建構出。首先,將傳統單層蕈狀結構結合懸置微帶線之理論,推廣至多層結構,使其擁有多頻電磁帶隙特性,達到電路縮小化效果。接著將三組所設計的雙頻電磁帶隙電路作環形串聯,並經過妥善的阻抗匹配,進而完成三頻雙工環路器之設計,它結合了雙工器與環路器之功能,其可使GSM 1800MHz、WiFi 2.45GHz和WiMAX 3.5GHz系統之間,作多頻段與多通道的資料整合。zh_TW
dc.language.isozh_TWen_US
dc.title多頻雙工環路器zh_TW
dc.typePatentsen_US
dc.citation.patentcountryTWNzh_TW
dc.citation.patentnumberI407692zh_TW
Appears in Collections:Patents


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