Vertical Transmission Structure

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DC 欄位	值	語言
dc.contributor.author	Chang, Edward Yi	en_US
dc.contributor.author	Wu, Wei-Cheng	en_US
dc.contributor.author	Hwang, Ruey-Bing	en_US
dc.contributor.author	Hsu, Li-Han	en_US
dc.date.accessioned	2014-12-16T06:15:45Z	-
dc.date.available	2014-12-16T06:15:45Z	-
dc.date.issued	2009-10-29	en_US
dc.identifier.govdoc	H01L023/498	zh_TW
dc.identifier.govdoc	H01P001/00	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/105471	-
dc.description.abstract	A vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission structure is applied to a high-frequency flip chip package for reducing the possibility of underfill from coming in contact with the conductive axial core.	zh_TW
dc.language.iso	zh_TW	en_US
dc.title	Vertical Transmission Structure	zh_TW
dc.type	Patents	en_US
dc.citation.patentcountry	USA	zh_TW
dc.citation.patentnumber	20090267201	zh_TW
顯示於類別：	專利資料

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