Title: 三維微探針陣列的組裝結構
Authors: 邱俊誠
張志瑋
Issue Date: 11-Sep-2011
Abstract: 一種三維微探針陣列的組裝結構,利用墊片(spacer)的概念,疊加單片側向式探針成為三維立體結構,並且使每一片側向式探針之導電片皆於墊片露出,使得導線易於連接,而可同時偵測深度與角度,有效的增進感測可靠度,此外,亦可將相關訊號處理積體電路與墊片整合,更可達到整合電路與降低製造成本的優勢。
Gov't Doc #: G01R001/073
URI: http://hdl.handle.net/11536/106073
Patent Country: TWN
Patent Number: I348552
Appears in Collections:Patents


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