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dc.contributor.author蕭智文en_US
dc.contributor.author羅正忠en_US
dc.contributor.author陳昶維en_US
dc.date.accessioned2014-12-16T06:16:54Z-
dc.date.available2014-12-16T06:16:54Z-
dc.date.issued2009-12-11en_US
dc.identifier.govdocC23C018/16zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/106159-
dc.description.abstract本發明關於利用液相沉積法以成長具有高介電常數之絕緣膜,特別是二氫化鉿絕緣層之方法,包括: (a)將二氧化鉿(HfO2)粉末加入氫氟酸(HF)溶液中,形成氫氟鉿酸鹽(HxHfyFz)溶液,並於低溫下加以攪拌溶解,使成為飽和溶液; (b)加入去離子水於該飽和溶液中,使其成為過飽和溶液; (c)將矽基板置入該過飽和溶液中,由於化學逆反應,可沉積高介電常數二氧化鉿(HfO2)薄膜於該矽基板上。 This invention relating to process using liquid phase deposition to form film of high dielectric material, particularly hafnium dioxide, which comprisses: (1) applying powdered hafnium dioxide into solution of hydrogen fluoride for preparing solution of HxHfyFz salts, and stirring the solution at low temperature to dissolve the salts to a saturated state; (2) adding de-ion water into said saturated solution and making it be a super-saturated state; (3) applying a silicon substrate into the super-saturated solution and depositing high dielectric hafnium dioxide on the surface of the substrate due to reversed chemical reaction in said solution.zh_TW
dc.language.isozh_TWen_US
dc.title以液相沉積成長二氧化鉿薄膜之方法zh_TW
dc.typePatentsen_US
dc.citation.patentcountryTWNzh_TW
dc.citation.patentnumberI318245zh_TW
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