Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 李承士 | en_US |
| dc.contributor.author | 張翼 | en_US |
| dc.contributor.author | 張晃崇 | en_US |
| dc.date.accessioned | 2014-12-16T06:17:07Z | - |
| dc.date.available | 2014-12-16T06:17:07Z | - |
| dc.date.issued | 2006-12-01 | en_US |
| dc.identifier.govdoc | H01L021/768 | zh_TW |
| dc.identifier.uri | http://hdl.handle.net/11536/106292 | - |
| dc.description.abstract | 一種三五族半導體元件的內連導線與其製造方法。此內連導線是由第一黏著層、防止銅擴散之擴散阻障層、第二黏著層以及銅導線所構成。由於在內連導線與此三五族半導體元件之間配置了第一黏著層/擴散阻障層/第二黏著層的推疊層結構，因此改善了擴散阻障層對其他材料的黏著性不佳的問題，從而增加元件的良率。 | zh_TW |
| dc.language.iso | zh_TW | en_US |
| dc.title | 三五族半導體元件的內連銅導線與其製造方法 | zh_TW |
| dc.type | Patents | en_US |
| dc.citation.patentcountry | TWN | zh_TW |
| dc.citation.patentnumber | I267946 | zh_TW |
| Appears in Collections: | Patents | |
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