Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | 葉清發 | en_US |
dc.contributor.author | 陳添富 | en_US |
dc.contributor.author | 羅正忠 | en_US |
dc.date.accessioned | 2014-12-16T06:17:19Z | - |
dc.date.available | 2014-12-16T06:17:19Z | - |
dc.date.issued | 2005-06-11 | en_US |
dc.identifier.govdoc | H01L021/8232 | zh_TW |
dc.identifier.govdoc | H01L029/786 | zh_TW |
dc.identifier.govdoc | H01L021/8232 | zh_TW |
dc.identifier.govdoc | H01L029/786 | zh_TW |
dc.identifier.uri | http://hdl.handle.net/11536/106378 | - |
dc.description.abstract | 本發明係一種在玻璃基板上製作單晶矽薄膜電晶體之方法,其係利用具單一晶格方向的矽基板作為晶種以觸發非晶矽薄膜側向成長單晶矽薄膜的方法,作法為將非晶矽薄膜與有圖案之單晶矽基板面對面接觸後,利用準分子雷射從背面穿透玻璃基板使正面的非晶矽薄膜得以單晶矽基板上之圖案為晶種側向成長單晶矽薄膜,如此便可進一步在玻璃基板上製作單晶矽的薄膜電晶體,作為晶種的矽基板經過簡單處理後就可重複使用,在量產上並不會增加太多的製造成本,並具有較高的載子移動率與較好的元件均勻性及可靠度。 | zh_TW |
dc.language.iso | zh_TW | en_US |
dc.title | 在玻璃基板上製作單晶矽薄膜電晶體之方法 | zh_TW |
dc.type | Patents | en_US |
dc.citation.patentcountry | TWN | zh_TW |
dc.citation.patentnumber | I234235 | zh_TW |
Appears in Collections: | Patents |
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