Erratum: "Thermomigration in flip-chip SnPb solder joints under alternate current stressing" [Appl. Phys. Lett. 90, 152105 (2007)]

Full metadata record

DC Field	Value	Language
dc.contributor.author	Hsiao, Hsiang-Yao	en_US
dc.contributor.author	Chen, Chih	en_US
dc.date.accessioned	2014-12-08T15:13:50Z	-
dc.date.available	2014-12-08T15:13:50Z	-
dc.date.issued	2007-06-11	en_US
dc.identifier.issn	0003-6951	en_US
dc.identifier.uri	http://dx.doi.org/10.1063/1.2748851	en_US
dc.identifier.uri	http://hdl.handle.net/11536/10692	-
dc.language.iso	en_US	en_US
dc.title	Erratum: "Thermomigration in flip-chip SnPb solder joints under alternate current stressing" [Appl. Phys. Lett. 90, 152105 (2007)]	en_US
dc.type	Correction	en_US
dc.identifier.doi	10.1063/1.2748851	en_US
dc.identifier.journal	APPLIED PHYSICS LETTERS	en_US
dc.citation.volume	90	en_US
dc.citation.issue	24	en_US
dc.citation.epage		en_US
dc.contributor.department	材料科學與工程學系	zh_TW
dc.contributor.department	Department of Materials Science and Engineering	en_US
dc.identifier.wosnumber	WOS:000247305400119	-
dc.citation.woscount	0	-
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