Erratum: "Thermomigration in flip-chip SnPb solder joints under alternate current stressing" [Appl. Phys. Lett. 90, 152105 (2007)]

Title:	Erratum: "Thermomigration in flip-chip SnPb solder joints under alternate current stressing" [Appl. Phys. Lett. 90, 152105 (2007)]
Authors:	Hsiao, Hsiang-Yao Chen, Chih 材料科學與工程學系 Department of Materials Science and Engineering
Issue Date:	11-Jun-2007
URI:	http://dx.doi.org/10.1063/1.2748851 http://hdl.handle.net/11536/10692
ISSN:	0003-6951
DOI:	10.1063/1.2748851
Journal:	APPLIED PHYSICS LETTERS
Volume:	90
Issue:	24
End Page:
Appears in Collections:	Articles

Files in This Item:

If it is a zip file, please download the file and unzip it, then open index.html in a browser to view the full text content.