Full metadata record
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Huang, Yu Wen | en_US |
dc.contributor.author | Chao, Yuan | en_US |
dc.contributor.author | Chen, C. C. | en_US |
dc.contributor.author | Cheng, Y. T. | en_US |
dc.date.accessioned | 2014-12-08T15:13:50Z | - |
dc.date.available | 2014-12-08T15:13:50Z | - |
dc.date.issued | 2007-06-11 | en_US |
dc.identifier.issn | 0003-6951 | en_US |
dc.identifier.uri | http://dx.doi.org/10.1063/1.2748301 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/10693 | - |
dc.description.abstract | This letter presents a power consumption reduction scheme of magnetic microactuation using Cu-Ni nanocomposite film which is electroplated in alkaline noncyanide based Ni colloidal copper plating solution at 40 degrees C. The superconducting quantum interference device magnetometer measurements show that Cu film is modified from diamagnetism to ferromagnetism via the incorporation of Ni ferromagnetic nanoparticles into itself to form a Cu-Ni nanocomposite film. A magnetic microactuator made of the nanocomposite can have about 9% performance improvement in terms of actuation enlargement. In other words, the coil made of the Cu-Ni nanocomposite can exhibit better power efficiency for the same output displacement. (c) 2007 American Institute of Physics. | en_US |
dc.language.iso | en_US | en_US |
dc.title | Power consumption reduction scheme of magnetic microactuation using electroplated Cu-Ni nanocomposite | en_US |
dc.type | Article | en_US |
dc.identifier.doi | 10.1063/1.2748301 | en_US |
dc.identifier.journal | APPLIED PHYSICS LETTERS | en_US |
dc.citation.volume | 90 | en_US |
dc.citation.issue | 24 | en_US |
dc.citation.epage | en_US | |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000247305400114 | - |
dc.citation.woscount | 3 | - |
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