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dc.contributor.authorHuang, Yu Wenen_US
dc.contributor.authorChao, Yuanen_US
dc.contributor.authorChen, C. C.en_US
dc.contributor.authorCheng, Y. T.en_US
dc.date.accessioned2014-12-08T15:13:50Z-
dc.date.available2014-12-08T15:13:50Z-
dc.date.issued2007-06-11en_US
dc.identifier.issn0003-6951en_US
dc.identifier.urihttp://dx.doi.org/10.1063/1.2748301en_US
dc.identifier.urihttp://hdl.handle.net/11536/10693-
dc.description.abstractThis letter presents a power consumption reduction scheme of magnetic microactuation using Cu-Ni nanocomposite film which is electroplated in alkaline noncyanide based Ni colloidal copper plating solution at 40 degrees C. The superconducting quantum interference device magnetometer measurements show that Cu film is modified from diamagnetism to ferromagnetism via the incorporation of Ni ferromagnetic nanoparticles into itself to form a Cu-Ni nanocomposite film. A magnetic microactuator made of the nanocomposite can have about 9% performance improvement in terms of actuation enlargement. In other words, the coil made of the Cu-Ni nanocomposite can exhibit better power efficiency for the same output displacement. (c) 2007 American Institute of Physics.en_US
dc.language.isoen_USen_US
dc.titlePower consumption reduction scheme of magnetic microactuation using electroplated Cu-Ni nanocompositeen_US
dc.typeArticleen_US
dc.identifier.doi10.1063/1.2748301en_US
dc.identifier.journalAPPLIED PHYSICS LETTERSen_US
dc.citation.volume90en_US
dc.citation.issue24en_US
dc.citation.epageen_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000247305400114-
dc.citation.woscount3-
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