完整後設資料紀錄
DC 欄位語言
dc.contributor.author張添榜en_US
dc.contributor.authorChang, Tien-pangen_US
dc.date.accessioned2014-12-19T03:51:12Z-
dc.date.available2014-12-19T03:51:12Z-
dc.date.issued2009en_US
dc.identifier.issn1811-3095en_US
dc.identifier.urihttp://hdl.handle.net/11536/107654-
dc.identifier.urihttp://www.itl.nctu.edu.tw/tlr_n/ch/list6_1.htmlen_US
dc.subject積電電路zh_TW
dc.subject電路布局zh_TW
dc.subject晶片zh_TW
dc.subject積體電路電路布局保護法zh_TW
dc.subject晶片保護法zh_TW
dc.subject實證研究zh_TW
dc.subject實證分析zh_TW
dc.subjectIntegrated circuitzh_TW
dc.subjectCircuit layoutzh_TW
dc.subjectChipzh_TW
dc.subjectIntegrated circuits layout protection lawzh_TW
dc.subjectChip protection actzh_TW
dc.subjectEmpirical studyzh_TW
dc.subjectEmpirical analysiszh_TW
dc.title以實證觀點檢視我國積體電路電路布局保護法十二年的運作zh_TW
dc.identifier.journal科技法學評論zh_TW
dc.citation.volume6en_US
dc.citation.issue1en_US
dc.citation.spage75en_US
dc.citation.epage111en_US
dc.contributor.department科技法律研究所zh_TW
dc.contributor.departmentInstitute of Technology Lawen_US
顯示於類別:交大法學評論


文件中的檔案:

  1. 6_1_2.pdf

若為 zip 檔案,請下載檔案解壓縮後,用瀏覽器開啟資料夾中的 index.html 瀏覽全文。