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dc.contributor.authorHwang, Ruey Bingen_US
dc.contributor.authorPan, Jun Liangen_US
dc.date.accessioned2014-12-08T15:13:59Z-
dc.date.available2014-12-08T15:13:59Z-
dc.date.issued2007-06-01en_US
dc.identifier.issn0895-2477en_US
dc.identifier.urihttp://dx.doi.org/10.1002/mop.22438en_US
dc.identifier.urihttp://hdl.handle.net/11536/10767-
dc.description.abstractIn this paper, we presented a band-pass filter-consisting of a post-wall cavity, resonator. This band-pass filter was fabricated in a two-layered printed circuit board, which includes an input and an output substrate integrated waveguides as the feeding structures in the top layer and a cavity in the bottom layer. The interconnection of the signal between different layers is achieved via the apertures etched on the input and output waveguides and cavity. We found the bandwidth of such a class of band-pass filter could be altered by tuning the length of the coupling apertures. Besides, the pass-band frequency can be estimated by the resonant frequencies of the cavity. We have fabricated the bandpass filter on a low-loss dielectric substrate and measured its S-parameters, including the return- and insertion-loss. In addition, the numerical simulation by the CST microwave studio, a full-wave time-domain numerical method, was also carried out. A good agreement between the measured and simulation results was obtained. (c) 2007 Wiley Periodicals, Inc.en_US
dc.language.isoen_USen_US
dc.subjectvia-hole-array waveguideen_US
dc.subjectperiodic structuresen_US
dc.subjectband-pass filteren_US
dc.titleA band-pass filter using via-hole-wall cavityen_US
dc.typeArticleen_US
dc.identifier.doi10.1002/mop.22438en_US
dc.identifier.journalMICROWAVE AND OPTICAL TECHNOLOGY LETTERSen_US
dc.citation.volume49en_US
dc.citation.issue6en_US
dc.citation.spage1456en_US
dc.citation.epage1459en_US
dc.contributor.department電信工程研究所zh_TW
dc.contributor.departmentInstitute of Communications Engineeringen_US
dc.identifier.wosnumberWOS:000245815300064-
dc.citation.woscount3-
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