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dc.contributor.authorKao, Chih-Chiangen_US
dc.contributor.authorKuo, H. C.en_US
dc.contributor.authorYeh, K. F.en_US
dc.contributor.authorChu, J. T.en_US
dc.contributor.authorPeng, W. L.en_US
dc.contributor.authorHuang, H. W.en_US
dc.contributor.authorLu, T. C.en_US
dc.contributor.authorWang, S. C.en_US
dc.date.accessioned2014-12-08T15:14:11Z-
dc.date.available2014-12-08T15:14:11Z-
dc.date.issued2007-05-01en_US
dc.identifier.issn1041-1135en_US
dc.identifier.urihttp://dx.doi.org/10.1109/LPT.2007.897455en_US
dc.identifier.urihttp://hdl.handle.net/11536/10870-
dc.description.abstractIn this paper, we report the fabrication and characteristics of nano-roughened GaN laser lift-off (LLO) light-emitting diodes (LEDs) with different scale surface roughness. The surface roughness of devices was controlled by inductively coupled plasma reactive inn etching. Using this fabrication method to form nanoscaled roughness, the electrical property was almost not degraded. Furthermore, the light-output power and wall-plug efficiency of LLO LED could be both significantly enhanced about two times using this simple method.en_US
dc.language.isoen_USen_US
dc.subjectGaNen_US
dc.subjectlaser lift-off (LLO)en_US
dc.subjectlight-emitting diode (LED)en_US
dc.subjectlight extraction efficiencyen_US
dc.subjectnano-roughened surfaceen_US
dc.titleLight-output enhancement of nano-roughened GaN laser lift-off light-emitting diodes formed by ICP dry etchingen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/LPT.2007.897455en_US
dc.identifier.journalIEEE PHOTONICS TECHNOLOGY LETTERSen_US
dc.citation.volume19en_US
dc.citation.issue9-12en_US
dc.citation.spage849en_US
dc.citation.epage851en_US
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentDepartment of Photonicsen_US
dc.identifier.wosnumberWOS:000247353100072-
dc.citation.woscount16-
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