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dc.contributor.authorTsai, H. Y.en_US
dc.contributor.authorTing, C. J.en_US
dc.contributor.authorChou, C. P.en_US
dc.date.accessioned2014-12-08T15:14:49Z-
dc.date.available2014-12-08T15:14:49Z-
dc.date.issued2007-02-01en_US
dc.identifier.issn0925-9635en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.diamond.2006.06.007en_US
dc.identifier.urihttp://hdl.handle.net/11536/11183-
dc.description.abstractThe current study compared several polishing techniques of chemical vapor deposition (CVD) diamond films. Although research on various diamond polishing techniques has been carried for years, some issues still need to be examined in order to facilitate application on large areas in a cost-efficient manner. In the present work, microwave plasma enhanced chemical vapor deposition (CVD) was used to obtain diamond films with full width half magnitude (FWHM) less than 10 wavenummbers at 1332 cm(-1) Raman peak. The diamond films were processed through mechanical polishing, chemical-assisted mechanical polishing, thermo-chemical polishing, excimer laser ablation, and catalytic reaction assisted grinding. A profilometer, an atomic force microscope, and a scanning electron microscope have been used to evaluate the surface morphology of diamond Films before and after polishing. The results obtained by using the above mentioned techniques were analyzed and compared. (c) 2006 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectdiamond film polishingen_US
dc.subjectchemical-assisted mechanical polishingen_US
dc.subjectcatalytic reaction assisted grindingen_US
dc.subjectthermo-clieniical polishingen_US
dc.titleEvaluation research of polishing methods for large area diamond films produced by chemical vapor depositionen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.diamond.2006.06.007en_US
dc.identifier.journalDIAMOND AND RELATED MATERIALSen_US
dc.citation.volume16en_US
dc.citation.issue2en_US
dc.citation.spage253en_US
dc.citation.epage261en_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.identifier.wosnumberWOS:000244512500013-
dc.citation.woscount17-
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