統計資料
總造訪次數
| 檢視 | |
|---|---|
| Bond pad design with low capacitance in CMOS technology for RF applications | 107 |
本月總瀏覽
檔案下載
| 檢視 | |
|---|---|
| 000243280900023.pdf | 8 |
國家瀏覽排行
| 檢視 | |
|---|---|
| 中國 | 99 |
| 美國 | 8 |
縣市瀏覽排行
| 檢視 | |
|---|---|
| Shenzhen | 96 |
| Menlo Park | 5 |
| Kensington | 2 |
| Zhengzhou | 2 |
| Edmond | 1 |
| Shanghai | 1 |
| 檢視 | |
|---|---|
| Bond pad design with low capacitance in CMOS technology for RF applications | 107 |
| 檢視 | |
|---|---|
| 000243280900023.pdf | 8 |
| 檢視 | |
|---|---|
| 中國 | 99 |
| 美國 | 8 |
| 檢視 | |
|---|---|
| Shenzhen | 96 |
| Menlo Park | 5 |
| Kensington | 2 |
| Zhengzhou | 2 |
| Edmond | 1 |
| Shanghai | 1 |