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dc.contributor.authorHsu, Hung-Lungen_US
dc.contributor.authorChang, Yu-Ruen_US
dc.contributor.authorChiu, Yien_US
dc.contributor.authorLin, Yu-Hsinen_US
dc.contributor.authorHsu, Wensyangen_US
dc.date.accessioned2014-12-08T15:15:21Z-
dc.date.available2014-12-08T15:15:21Z-
dc.date.issued2006-12-01en_US
dc.identifier.issn0960-1317en_US
dc.identifier.urihttp://dx.doi.org/10.1088/0960-1317/16/12/016en_US
dc.identifier.urihttp://hdl.handle.net/11536/11515-
dc.description.abstractFor near-field optical systems, an aperture in nano-size and a solid immersion lens (SIL) are two popular methods to overcome the diffraction limit and reduce the optical spot size. In previous research, combining a nano-aperture and SIL has been proposed to provide high throughput and ultra-high resolution. However, alignment between the nano-aperture and SIL is very critical in the fabrication process, and no effective alignment technique has been investigated yet. In this research, a novel self-alignment technique is proposed for the combination of the nano-aperture and SIL, where the nano-aperture is fabricated with the focused ion beam (FIB) system and the SIL is formed by the thermal reflowing process. The self-alignment technique is based on the backside exposure and the surface tension self-modulation technique during the thermal reflowing process. The maximum deviation of the fabricated SIL is less than 3% in comparison with the designed values. A SIL of 15 mu m diameter has been measured with 65.2% transmission efficiency. The polymer SIL combined with the circular aperture of 329 nm diameter has 1.68 times enhancement on throughput compared with the circular aperture of 329 nm alone. This result shows that the SIL can effectively enhance the throughput of the nano-aperture, and the feasibility of the proposed self-alignment method is also verified.en_US
dc.language.isoen_USen_US
dc.titleA novel self-aligned process between a nano-aperture and a solid immersion lens for a near-field optical systemen_US
dc.typeArticleen_US
dc.identifier.doi10.1088/0960-1317/16/12/016en_US
dc.identifier.journalJOURNAL OF MICROMECHANICS AND MICROENGINEERINGen_US
dc.citation.volume16en_US
dc.citation.issue12en_US
dc.citation.spage2632en_US
dc.citation.epage2638en_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.department電控工程研究所zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.contributor.departmentInstitute of Electrical and Control Engineeringen_US
dc.identifier.wosnumberWOS:000242475200016-
dc.citation.woscount0-
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