標題: Effect of al trace dimension on electromigration failure time of flip-chip solder joints
作者: Chiu, S. H.
Chen, Chih
Yao, D. J.
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: electromigration;flip chip;Joule heating
公開日期: 1-Sep-2006
摘要: The effect of Al-trace dimension on electromigration of flip-chip solder joints was investigated. The Al trace dimension was found to have a significant influence on the electromigration failure time. When joints with Al traces 100 mu m wide were stressed by 1.0 A at 100 degrees C, failure times were 35 h, 1,700 h, and > 3,000 h for joints with Al traces that were 2,550 mu m, 1,700 mu m, and 850 mu m long, respectively. Solder joints with Al traces 40 mu m wide and 2,550 mu m long failed instantly at 0.6 A. The Joule heating effect was found to be responsible for the huge difference in failure time.
URI: http://hdl.handle.net/11536/11832
ISSN: 0361-5235
期刊: JOURNAL OF ELECTRONIC MATERIALS
Volume: 35
Issue: 9
起始頁: 1740
結束頁: 1744
Appears in Collections:Articles


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