標題: Reliability analysis using Weibull distribution on the breakdown of MIM capacitors
作者: Ho, Chia-Cheng
Chiou, Bi-Shiou
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
公開日期: 2007
摘要: Rapidly growing performance and mixed-signal integration are driving the needs for product and component miniaturization in electronics application. The passive components show great potential for high frequency, high density, and low cost applications. Regarding to the capacitors, the dielectric breakdown field is one of the important concerns for the capacitor reliability. The breakdown of dielectric is originated at a fatal flaw that grows to cause failure and can be explained by the weakest-link theory. In this study, metal-insulator-metal (MIM) capacitors with plasma enhanced chemical vapor deposited (PECVD) silicon nitride and oxide are prepared. Ammonia (NH3) and N2O plasma are applied after the deposition of the dielectric silicon nitride and oxide layer, respectively. The Weibull distribution function, which is based on the weakest-link theory, is employed to analyze the effect of the electrode area as well as the plasma treatment on the breakdown of the MINI capacitors. The time dependent dielectric breakdown testing indicates a decrease in both the leakage current and the lifetime of the SiNx MIM capacitors treated after NH3 plasma treatment. Possible dielectric degradation mechanism is explored.
URI: http://hdl.handle.net/11536/12034
ISBN: 978-1-4244-1636-3
期刊: 2007 INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE, PROCEEDINGS OF TECHNICAL PAPERS
起始頁: 270
結束頁: 273
顯示於類別:會議論文