完整後設資料紀錄
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dc.contributor.authorChiang, Tzu Hsuanen_US
dc.contributor.authorHsieh, T. -E.en_US
dc.date.accessioned2014-12-08T15:16:31Z-
dc.date.available2014-12-08T15:16:31Z-
dc.date.issued2006-06-01en_US
dc.identifier.issn1574-1443en_US
dc.identifier.urihttp://dx.doi.org/10.1007/s10904-006-9037-8en_US
dc.identifier.urihttp://hdl.handle.net/11536/12209-
dc.description.abstractPreparation and property characterization of encapsulation resin contained hexagonal boron nitride (hBN) as inorganic filler were carried out in this work. The dielectric properties, coefficient of thermal expansion (CTE), thermal conductivity, curing kinetics, adhesion strength and viscosity of the resins with the load of hBN filler ranging from 9.2 to 25.7 vol.% (20-70 wt.%) were evaluated. It was found that the dielectric properties of resin containing SiO2 filler are inferior to that containing hBN. Also, the resins possessed lower CTE and the higher T-g when the hBN contents were high (> 15 vol.%) and the resin containing 25.7 vol.% hBN exhibited the largest thermal conductivity of 1.08 W/m K. Adhesion strength of the composite resins decreased with increase of hBN content and the adhesion strength on various substrates was found to be in the order of: alumina > Si wafer > eutectic PbSn solder.en_US
dc.language.isoen_USen_US
dc.subjectencapsulation resinen_US
dc.subjecthexagonal boron nitride (hBN)en_US
dc.subjectinorganic filleren_US
dc.titleA study of encapsulation resin containing hexagonal boron nitride (hBN) as inorganic filleren_US
dc.typeArticleen_US
dc.identifier.doi10.1007/s10904-006-9037-8en_US
dc.identifier.journalJOURNAL OF INORGANIC AND ORGANOMETALLIC POLYMERS AND MATERIALSen_US
dc.citation.volume16en_US
dc.citation.issue2en_US
dc.citation.spage175en_US
dc.citation.epage183en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000239813000010-
dc.citation.woscount16-
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