Critical length of electromigration for eutectic SnPb solder stripe

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	Wei, CC	en_US
dc.contributor.author	Chen, C	en_US
dc.date.accessioned	2014-12-08T15:16:37Z	-
dc.date.available	2014-12-08T15:16:37Z	-
dc.date.issued	2006-05-01	en_US
dc.identifier.issn	0003-6951	en_US
dc.identifier.uri	http://dx.doi.org/10.1063/1.2200158	en_US
dc.identifier.uri	http://hdl.handle.net/11536/12269	-
dc.description.abstract	The critical length of eutectic SnPb solder was investigated using solder stripes. By employing focus ion beam, solder stripes of various lengths, including 5, 10, 15, 20, 30, 100, and 200 mu m, can be fabricated. Length-dependent electromigration behavior was observed, which implies that there may be back stress under stressing. The critical length was determined to be between 10 and 15 mu m under stressing by 2x10(4) A/cm(2) at 100 degrees C, and the corresponding critical product was between 20 and 30 A/cm. Both values show good agreement with their theoretical values. (c) 2006 American Institute of Physics.	en_US
dc.language.iso	en_US	en_US
dc.title	Critical length of electromigration for eutectic SnPb solder stripe	en_US
dc.type	Article	en_US
dc.identifier.doi	10.1063/1.2200158	en_US
dc.identifier.journal	APPLIED PHYSICS LETTERS	en_US
dc.citation.volume	88	en_US
dc.citation.issue	18	en_US
dc.citation.epage		en_US
dc.contributor.department	材料科學與工程學系	zh_TW
dc.contributor.department	Department of Materials Science and Engineering	en_US
dc.identifier.wosnumber	WOS:000237321600043	-
dc.citation.woscount	14	-
顯示於類別：	期刊論文

文件中的檔案：

若為 zip 檔案，請下載檔案解壓縮後，用瀏覽器開啟資料夾中的 index.html 瀏覽全文。