INTERCONNECTING STRUCTURE FOR ELECTRICALLY CONNECTING A FIRST ELECTRONIC DEVICE WITH A SECOND ELECTRONIC DEVICE

完整後設資料紀錄

DC 欄位	值	語言
dc.contributor.author	Li Chun-Hsing	en_US
dc.contributor.author	Kuo Chien-Nan	en_US
dc.contributor.author	Ko Chun-Lin	en_US
dc.date.accessioned	2015-05-12T02:59:51Z	-
dc.date.available	2015-05-12T02:59:51Z	-
dc.date.issued	2015-03-12	en_US
dc.identifier.govdoc	H01P003/08	zh_TW
dc.identifier.uri	http://hdl.handle.net/11536/122862	-
dc.description.abstract	An interconnecting structure for electrically connecting a first electronic device with a second electronic device is provided. The first electronic device has two first bond-pads, and the second electronic device has two second bond-pads electrically connected to the two first bond-pads respectively. The interconnecting structure includes a signal transmission structure electrically connected to the two first bond-pads and the two second bond-pads; and a ground device disposed between the first electronic device and the second electronic device so that the first electronic device and the second electronic device have a same ground potential.	zh_TW
dc.language.iso	zh_TW	en_US
dc.title	INTERCONNECTING STRUCTURE FOR ELECTRICALLY CONNECTING A FIRST ELECTRONIC DEVICE WITH A SECOND ELECTRONIC DEVICE	zh_TW
dc.type	Patents	en_US
dc.citation.patentcountry	USA	zh_TW
dc.citation.patentnumber	20150068024	zh_TW
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