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dc.contributor.authorLi Chun-Hsingen_US
dc.contributor.authorKuo Chien-Nanen_US
dc.contributor.authorKo Chun-Linen_US
dc.date.accessioned2015-05-12T02:59:51Z-
dc.date.available2015-05-12T02:59:51Z-
dc.date.issued2015-03-12en_US
dc.identifier.govdocH01P003/08zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/122862-
dc.description.abstractAn interconnecting structure for electrically connecting a first electronic device with a second electronic device is provided. The first electronic device has two first bond-pads, and the second electronic device has two second bond-pads electrically connected to the two first bond-pads respectively. The interconnecting structure includes a signal transmission structure electrically connected to the two first bond-pads and the two second bond-pads; and a ground device disposed between the first electronic device and the second electronic device so that the first electronic device and the second electronic device have a same ground potential.zh_TW
dc.language.isozh_TWen_US
dc.titleINTERCONNECTING STRUCTURE FOR ELECTRICALLY CONNECTING A FIRST ELECTRONIC DEVICE WITH A SECOND ELECTRONIC DEVICEzh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber20150068024zh_TW
Appears in Collections:Patents


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