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dc.contributor.authorKao, Kai-Chiehen_US
dc.contributor.authorChang, Wei-Yuanen_US
dc.contributor.authorChang, Yu-Minen_US
dc.contributor.authorLeu, Jihperngen_US
dc.contributor.authorCheng, Yi-Lungen_US
dc.date.accessioned2015-07-21T11:20:43Z-
dc.date.available2015-07-21T11:20:43Z-
dc.date.issued2014-11-01en_US
dc.identifier.issn0734-2101en_US
dc.identifier.urihttp://dx.doi.org/10.1116/1.4900854en_US
dc.identifier.urihttp://hdl.handle.net/11536/123936-
dc.description.abstractThis study comprehensively investigates the effect of ultraviolet (UV) curing time on the physical, electrical, and reliability characteristics of porous low-k materials. Following UV irradiation for various periods, the depth profiles of the chemical composition in the low-k dielectrics were homogeneous. Initially, the UV curing process preferentially removed porogen-related CHx groups and then modified Si-CH3 and cage Si-O bonds to form network Si-O bonds. The lowest dielectric constant (k value) was thus obtained at a UV curing time of 300 s. Additionally, UV irradiation made porogen-based low-k materials hydrophobic and to an extent that increased with UV curing time. With a short curing time (<300 s), porogen was not completely removed and the residues degraded reliability performance. A long curing time (>300 s) was associated with improved mechanical strength, electrical performance, and reliability of the low-k materials, but none of these increased linearly with UV curing time. Therefore, UV curing is necessary, but the process time must be optimized for porous low-k materials on back-end of line integration in 45 nm or below technology nodes. (C) 2014 American Vacuum Society.en_US
dc.language.isoen_USen_US
dc.titleEffect of UV curing time on physical and electrical properties and reliability of low dielectric constant materialsen_US
dc.typeArticleen_US
dc.identifier.doi10.1116/1.4900854en_US
dc.identifier.journalJOURNAL OF VACUUM SCIENCE & TECHNOLOGY Aen_US
dc.citation.volume32en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000345215500027en_US
dc.citation.woscount0en_US
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