標題: | Complementary solvent additives tune the orientation of polymer lamellae, reduce the sizes of aggregated fullerene domains, and enhance the performance of bulk heterojunction solar cells |
作者: | Liu, Chih-Ming Su, Yu-Wei Jiang, Jian-Ming Chen, Hsiu-Cheng Lin, Shu-Wei Su, Chun-Jen Jeng, U-Ser Wei, Kung-Hwa 材料科學與工程學系 Department of Materials Science and Engineering |
公開日期: | 1-Jan-2014 |
摘要: | In this study we employed 1-chloronaphthalene (CN) and 1,8-diiodooctane (DIO) as binary additives exhibiting complementarily preferential solubility for processing the crystalline conjugated polymer poly[bis(dodecyl)thiophene-dodecyl-thieno[3,4-c]pyrrole-4,6-dione] (PBTC12TPD) and the fullerene [6,6]-phenyl-C-71-butyric acid methyl ester (PC71BM) in chloroform. Using synchrotron grazing-incidence small-/wide-angle X-ray scattering and transmission electron microscopy to analyse the structure of the PBTC12TPD-PC71BM blend films, we found that the binary additives with different volume ratios in the processing solvent allow us to tune the relative population of face-on to edge-on PBTC12TPD lamellae and the size of PC71BM clusters in the blend films; the sizes of the fractal-like PC71BM clusters and the aggregated domains of PC71BM clusters increased and decreased, respectively, upon increasing the amount of DIO, whereas the relative ratio of face-on to edge-on PBTC12TPD lamellae increased upon increasing the amount of CN. When fabricating the photovoltaic devices, the short-circuit current density of the devices with the PBTC12TPD-PC71BM active layer having been processed with the binary additives is higher than that of the device incorporating an active layer processed without any additive. As a result, the power conversion efficiency of a device incorporating an active layer of PBTC12TPD-PC71BM (1 : 1.5, w/w) processed with binary additives of 0.5% DIO and 1% CN in chloroform increased to 6.8% from a value of 4.9%, a relative increase of 40%, for the corresponding device containing the same active layer but processed without any additive. |
URI: | http://dx.doi.org/10.1039/c4ta04804k http://hdl.handle.net/11536/123996 |
ISSN: | 2050-7488 |
DOI: | 10.1039/c4ta04804k |
期刊: | JOURNAL OF MATERIALS CHEMISTRY A |
Issue: | 48 |
起始頁: | 20760 |
結束頁: | 20769 |
Appears in Collections: | Articles |
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