Title: | Interfacial reactions between Cu and SnAgCu solder doped with minor Ni |
Authors: | Cheng, Hsi-Kuei Huang, Chin-Wen Lee, Hsuan Wang, Ying-Lang Liu, Tzeng-Feng Chen, Chih-Ming 材料科學與工程學系 照明與能源光電研究所 Department of Materials Science and Engineering Institute of Lighting and Energy Photonics |
Keywords: | Ni;Microstructure;Grain size |
Issue Date: | 15-Feb-2015 |
Abstract: | The interfacial reactions between Cu and SnAgCu-based solders were investigated. Two types of SnAgCu-based solders were used, one was Sn-1.0Ag-0.5Cu (SAC105) and the other was Sn-1.2Ag-0.5Cu-0.05Ni (LF35), where the composition was in wt.%. The addition of Ni in the SnAgCu-based solder was found to have significant effects on the morphological evolution and growth of the Cu6Sn5 and Cu3Sn phases formed at the solder/Cu interfaces. At the Ni-added LF35/Cu interface after liquid/solid reaction at 260 degrees C,the Cu6Sn5 phase presented a microstructure with a much smaller grain size. During subsequent solid/solid reaction at 150 and 200 degrees C, the growth of the Cu6Sn5 phase was significantly enhanced at the LF35/Cu interface but that of the Cu3Sn phase was inhibited. A potential mechanism was proposed to explain the effects of Ni addition on the solder/Cu interfacial reactions. (C) 2014 Elsevier B. V. All rights reserved. |
URI: | http://dx.doi.org/10.1016/j.jallcom.2014.10.121 http://hdl.handle.net/11536/124023 |
ISSN: | 0925-8388 |
DOI: | 10.1016/j.jallcom.2014.10.121 |
Journal: | JOURNAL OF ALLOYS AND COMPOUNDS |
Volume: | 622 |
Begin Page: | 529 |
End Page: | 534 |
Appears in Collections: | Articles |