標題: A 37.5-mW 8-dBm-EIRP 15.5 degrees-HPBW 338-GHz Terahertz Transmitter Using SoP Heterogeneous System Integration
作者: Li, Chun-Hsing
Chao, Tzu-Yuan
Lai, Chih-Wei
Chen, Wei-Cheng
Ko, Chun-Lin
Kuo, Chien-Nan
Cheng, Yu Ting
Kuo, Ming-Ching
Chang, Da-Chiang
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
關鍵字: CMOS;heterogeneous integration;high performance;low cost;low power;system-on-package (SoP);terahertz;transmitter
公開日期: 1-二月-2015
摘要: A low-cost terahertz transmitter is proposed by using system-on-package (SoP) heterogeneous system integration. A signal source in 40-nm CMOS is integrated with an antenna array on a Benzocyclobutene carrier through a broadband low-loss terahertz interconnect. The signal source adopting triple-push oscillator topology is able to produce a differential output without any additional balun circuit. Hence, the power consumption and the chip area can be reduced. The antenna array containing 50 patch antennas is differentially excited to give simulated directivity, efficiency, and antenna gain as high as 22.6 dB, 88%, and 22 dBi, respectively, at 335 GHz. The terahertz interconnect employs a resonator coupling technique to provide low-loss and broadband performance while occupying a small area. Measured results show that the proposed terahertz transmitter can work at 338.4 GHz with equivalent isotropically radiated power (EIRP) of 8.0 dBm while consuming only 37.5 mW from a 1-V supply. The measured half-power beam-width can be as narrow as 15.5 degrees. The EIRP can be further raised to 9.5 dBm as the supply V-DD is increased to 1.3 V. The CMOS chip only occupies an area as small as 0.028 mm(2). All of the design efforts enable the proposed terahertz transmitter to feature in small form factor, low power dissipation, low cost, and high performance. To the best of the authors\' knowledge, this is the most compact, lowest power, lowest cost, and high-performance SoP-based terahertz transmitter reported thus far.
URI: http://dx.doi.org/10.1109/TMTT.2014.2385853
http://hdl.handle.net/11536/124353
ISSN: 0018-9480
DOI: 10.1109/TMTT.2014.2385853
期刊: IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
Volume: 63
起始頁: 470
結束頁: 480
顯示於類別:期刊論文