標題: | Unusual Morphological Evolution of the Cu Pillar/Solder Micro-joints During High-Temperature Annealing |
作者: | Cheng, Hsi-Kuei Lin, Yu-Jie Chang, Hou-Chien Liu, Kuo-Chio Wang, Ying-Lang Liu, Tzeng-Feng Chen, Chih-Ming 材料科學與工程學系 照明與能源光電研究所 Department of Materials Science and Engineering Institute of Lighting and Energy Photonics |
公開日期: | 1-五月-2015 |
摘要: | The morphological evolution of Cu pillars capped with Sn-1.8 wt pct Ag solder during high-temperature annealing was investigated. Two intermetallic compounds (Cu6Sn5 + Cu3Sn) formed at the Cu/solder interface which changed the pillar\'s morphology. Surface diffusion enhanced the growth of Cu6Sn5 + Cu3Sn around the pillar brim and transformed the pillar top from a plane into a truncated cone. Bulk diffusion dominated after long-term annealing and the pillar top became hemispherical shaped. A mechanism was proposed to explain the unusual morphological evolution. (C) The Minerals, Metals & Materials Society and ASM International 2015 |
URI: | http://dx.doi.org/10.1007/s11661-015-2825-4 http://hdl.handle.net/11536/124450 |
ISSN: | 1073-5623 |
DOI: | 10.1007/s11661-015-2825-4 |
期刊: | METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE |
Volume: | 46A |
起始頁: | 1834 |
結束頁: | 1837 |
顯示於類別: | 期刊論文 |