標題: Unusual Morphological Evolution of the Cu Pillar/Solder Micro-joints During High-Temperature Annealing
作者: Cheng, Hsi-Kuei
Lin, Yu-Jie
Chang, Hou-Chien
Liu, Kuo-Chio
Wang, Ying-Lang
Liu, Tzeng-Feng
Chen, Chih-Ming
材料科學與工程學系
照明與能源光電研究所
Department of Materials Science and Engineering
Institute of Lighting and Energy Photonics
公開日期: 1-五月-2015
摘要: The morphological evolution of Cu pillars capped with Sn-1.8 wt pct Ag solder during high-temperature annealing was investigated. Two intermetallic compounds (Cu6Sn5 + Cu3Sn) formed at the Cu/solder interface which changed the pillar\'s morphology. Surface diffusion enhanced the growth of Cu6Sn5 + Cu3Sn around the pillar brim and transformed the pillar top from a plane into a truncated cone. Bulk diffusion dominated after long-term annealing and the pillar top became hemispherical shaped. A mechanism was proposed to explain the unusual morphological evolution. (C) The Minerals, Metals & Materials Society and ASM International 2015
URI: http://dx.doi.org/10.1007/s11661-015-2825-4
http://hdl.handle.net/11536/124450
ISSN: 1073-5623
DOI: 10.1007/s11661-015-2825-4
期刊: METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE
Volume: 46A
起始頁: 1834
結束頁: 1837
顯示於類別:期刊論文