Unusual Morphological Evolution of the Cu Pillar/Solder Micro-joints During High-Temperature Annealing

doi:10.1007/s11661-015-2825-4

Title:	Unusual Morphological Evolution of the Cu Pillar/Solder Micro-joints During High-Temperature Annealing
Authors:	Cheng, Hsi-Kuei Lin, Yu-Jie Chang, Hou-Chien Liu, Kuo-Chio Wang, Ying-Lang Liu, Tzeng-Feng Chen, Chih-Ming 材料科學與工程學系照明與能源光電研究所 Department of Materials Science and Engineering Institute of Lighting and Energy Photonics
Issue Date:	1-May-2015
Abstract:	The morphological evolution of Cu pillars capped with Sn-1.8 wt pct Ag solder during high-temperature annealing was investigated. Two intermetallic compounds (Cu6Sn5 + Cu3Sn) formed at the Cu/solder interface which changed the pillar\'s morphology. Surface diffusion enhanced the growth of Cu6Sn5 + Cu3Sn around the pillar brim and transformed the pillar top from a plane into a truncated cone. Bulk diffusion dominated after long-term annealing and the pillar top became hemispherical shaped. A mechanism was proposed to explain the unusual morphological evolution. (C) The Minerals, Metals & Materials Society and ASM International 2015
URI:	http://dx.doi.org/10.1007/s11661-015-2825-4 http://hdl.handle.net/11536/124450
ISSN:	1073-5623
DOI:	10.1007/s11661-015-2825-4
Journal:	METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE
Volume:	46A
Begin Page:	1834
End Page:	1837
Appears in Collections:	Articles