完整後設資料紀錄
DC 欄位語言
dc.contributor.authorMeng, CCen_US
dc.contributor.authorSu, JYen_US
dc.contributor.authorTsou, BCen_US
dc.contributor.authorHuang, GWen_US
dc.date.accessioned2014-12-08T15:17:00Z-
dc.date.available2014-12-08T15:17:00Z-
dc.date.issued2006-04-01en_US
dc.identifier.issn0916-8524en_US
dc.identifier.urihttp://dx.doi.org/10.1093/ietele/e89-c.4.520en_US
dc.identifier.urihttp://hdl.handle.net/11536/12447-
dc.description.abstractA selectively ion-implanted collector (SIC) is implemented in a 0.8 mu m BiCMOS process to improve the RF characteristics of the BJT devices. The SIC BJT device has better f(t) and f(max) than the FIC (fully ion-implanted collector) BJT device because the extrinsic base-collector capacitance is reduced by the SIC process. The f(t) is 7.8GHz and f(max) is 9.5 GHz for the SIC BJT device while the f(t) is 7.2 GHz and f(max) is 4.5 GHz for the FIC BJT device when biased at V-ce =3.6 V and J(c) = 0.07 mA/mu m(2). The noise parameters are the same for both BJT devices but the associated gain is higher for the SIC BJT device.en_US
dc.language.isoen_USen_US
dc.subjectBJTen_US
dc.subjectselectively implanted collectoren_US
dc.titleThe effect of selectively and fully ion-implanted collector on RF characteristics of BJT devicesen_US
dc.typeArticleen_US
dc.identifier.doi10.1093/ietele/e89-c.4.520en_US
dc.identifier.journalIEICE TRANSACTIONS ON ELECTRONICSen_US
dc.citation.volumeE89Cen_US
dc.citation.issue4en_US
dc.citation.spage520en_US
dc.citation.epage523en_US
dc.contributor.department電信工程研究所zh_TW
dc.contributor.departmentInstitute of Communications Engineeringen_US
dc.identifier.wosnumberWOS:000237203600012-
dc.citation.woscount0-
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