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dc.contributor.authorChang, Yung-Chiaen_US
dc.contributor.authorLiang, Shu-Wenen_US
dc.date.accessioned2015-07-21T08:31:21Z-
dc.date.available2015-07-21T08:31:21Z-
dc.date.issued2014-01-01en_US
dc.identifier.isbn978-605-64453-0-9en_US
dc.identifier.issnen_US
dc.identifier.urihttp://hdl.handle.net/11536/125038-
dc.description.abstractProducts in the semiconductor manufacturing industry usually have characteristics of having short life-spans, volatility in demands and long lead times. Applying the demand-pull approach and buffer management (DPBM) suggested by the Theory of Constraints (TOC) to manage the inventory of such products does not efficiently respond to the unpredicted demand change thus could potentially result in either excessive inventories or shortages. This research proposed a new buffer adjustment mechanism to improve DPBM approach by applying the methodology of Exponentially Weighted Moving Average (EWMA) to integrate the true demands and the rolling forecasts of market in order to make the stock replenishing decision. Real product demand data provided by a wafer foundry in Taiwan is analyzed to demonstrate the effectiveness of the proposed approach. The study results show that the proposed idea can indeed keep a lower inventory level and provide a higher service standard in contrast to the traditional DPBM method.en_US
dc.language.isoen_USen_US
dc.subjectTheory of Constraintsen_US
dc.subjectDemand-pullen_US
dc.subjectBuffer managementen_US
dc.subjectExponentially Weighted Moving Averageen_US
dc.subjectRolling forecasten_US
dc.titleImproving the Efficiency of TOC Demand-Pull and Buffer Management by Incorporating Demand Information Using EWMA in Semiconductor Manufacturingen_US
dc.typeProceedings Paperen_US
dc.identifier.journalINTERNATIONAL CONFERENCE ON EDUCATION AND SOCIAL SCIENCES (INTCESS14), VOLS I AND IIen_US
dc.citation.spage516en_US
dc.citation.epage523en_US
dc.contributor.department工業工程與管理學系zh_TW
dc.contributor.departmentDepartment of Industrial Engineering and Managementen_US
dc.identifier.wosnumberWOS:000349913300054en_US
dc.citation.woscount0en_US
Appears in Collections:Conferences Paper