完整後設資料紀錄
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dc.contributor.authorHuang, Wei-Chingen_US
dc.contributor.authorWong, Yuen-Yeeen_US
dc.contributor.authorLiu, Kuan-Shinen_US
dc.contributor.authorHsieh, Chi-Fengen_US
dc.contributor.authorChang, Edward Yien_US
dc.date.accessioned2015-07-21T08:30:58Z-
dc.date.available2015-07-21T08:30:58Z-
dc.date.issued2014-01-01en_US
dc.identifier.isbn978-1-4799-5760-6en_US
dc.identifier.issnen_US
dc.identifier.urihttp://hdl.handle.net/11536/125105-
dc.description.abstractThe electrical properties in the InAlN/AlN/GaN high electron mobility transistor grown by metal-organic vapor deposition (MOCVD) with different growth parameters were investigated in this study. We observed that two-dimensional electron gas (2DEG) channel was influenced by thickness of AlN spacer layer and a stable stage prior to the growth of AlN spacer layer. The TEM images showed the generation of dislocations at interface between AlN/GaN and InAlN/AlN with the thicker AlN spacer layer. These dislocations acted as electron scattering center and degraded the electron mobility in the 2DEG channel. Besides, a too long stable stage also appeared degradation in the electron mobility due to the etching effect of H-2 gas. By optimizing growth parameters, the highest electron mobility of 890 cm(2)/V.sen_US
dc.language.isoen_USen_US
dc.subjectHEMTsen_US
dc.subjectInAlNen_US
dc.subjectGaNen_US
dc.subjectstylingen_US
dc.subjectinserten_US
dc.titleThe effects of Growth Parameters on the Electrical Properties in InAlN/AlN/GaN High-Electron-Mobility Transistors (HEMTs)en_US
dc.typeProceedings Paperen_US
dc.identifier.journal2014 IEEE INTERNATIONAL CONFERENCE ON SEMICONDUCTOR ELECTRONICS (ICSE)en_US
dc.citation.spage499en_US
dc.citation.epage501en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000353960000127en_US
dc.citation.woscount0en_US
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