標題: | High-selectivity damascene chemical mechanical polishing |
作者: | Chiu, SY Wang, YL Liu, CP Chang, SC Hwang, GJ Feng, MS Chen, CF 材料科學與工程學系 Department of Materials Science and Engineering |
關鍵字: | chemical mechanical polishing;micro-scratch;tantalum;copper |
公開日期: | 1-三月-2006 |
摘要: | In this study, multi-step chemical mechanical polishing (CMP) with different copper removal rates and polishing pads is used to eliminate topography efficiently and to reduce micro-scratches on copper films. In colloidal-silica-based slurry, the polishing behaviors of copper, tantalum and silicon dioxide are found to relate to that kind of alkaline additives. The size of cations from alkaline additives influences the zeta potential of slurries, so as to vary the material removal rate. The addition of small-sized K+ from KOH provides high removal selectivity of tantalum/copper and oxide/copper, so as to benefit the reduction of copper dishing. (c) 2005 Elsevier B.V All rights reserved. |
URI: | http://dx.doi.org/10.1016/j.tsf.2005.07.063 http://hdl.handle.net/11536/12546 |
ISSN: | 0040-6090 |
DOI: | 10.1016/j.tsf.2005.07.063 |
期刊: | THIN SOLID FILMS |
Volume: | 498 |
Issue: | 1-2 |
起始頁: | 60 |
結束頁: | 63 |
顯示於類別: | 會議論文 |