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dc.contributor.author施建宇en_US
dc.contributor.authorShih, Jian-Yuen_US
dc.contributor.author陳冠能en_US
dc.contributor.authorChen, Kuan-Nengen_US
dc.date.accessioned2015-11-26T00:55:40Z-
dc.date.available2015-11-26T00:55:40Z-
dc.date.issued2015en_US
dc.identifier.urihttp://140.113.39.130/cdrfb3/record/nctu/#GT079811540en_US
dc.identifier.urihttp://hdl.handle.net/11536/125934-
dc.language.isozh_TWen_US
dc.subject三維積體電路技術zh_TW
dc.subject矽直銅導孔zh_TW
dc.subject晶圓級接合zh_TW
dc.subject晶圓薄化技術zh_TW
dc.subject石英頻率元件zh_TW
dc.subject3D integrationen_US
dc.subjectCu through-silicon-viasen_US
dc.subjectWafer level bondingen_US
dc.subjectwafer thinning techniquesen_US
dc.subjectquartz resonator deviceen_US
dc.title三維積體電路之頻率振盪元件封裝特性與應用zh_TW
dc.titleStudy on Characteristics and Applications of Frequency Resonator Devices with 3D IC Integrationen_US
dc.typeThesisen_US
dc.contributor.department電子工程學系 電子研究所zh_TW
Appears in Collections:Thesis


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