標題: | Quartz resonator assembling with TSV interposer using polymer sealing or metal bonding |
作者: | Shih, Jian-Yu Chen, Yen-Chi Chiu, Chih-Hung Lo, Chung-Lun Chang, Chi-Chung Chen, Kuan-Neng 電子工程學系及電子研究所 Department of Electronics Engineering and Institute of Electronics |
關鍵字: | Three-dimensional (3D) integration;Through-silicon via (TSV);Wafer thinning;Sealing bonding |
公開日期: | 1-十月-2014 |
摘要: | This paper presents one wafer level packaging approach of quartz resonator based on through-silicon via (TSV) interposer with metal or polymer bonding sealing of frequency components. The proposed silicon-based package of quartz resonator adopts several three-dimensional (3D) core technologies, such as Cu TSVs, sealing bonding, and wafer thinning. It is different from conventional quartz resonator using ceramic-based package. With evaluation of mechanical structure design and package performances, this quartz resonator with advanced silicon-based package shows great manufacturability and excellent performance to replace traditional metal lid with ceramic-based interposer fabrication approach. |
URI: | http://dx.doi.org/10.1186/1556-276X-9-541 http://hdl.handle.net/11536/123981 |
ISSN: | 1556-276X |
DOI: | 10.1186/1556-276X-9-541 |
期刊: | NANOSCALE RESEARCH LETTERS |
顯示於類別: | 期刊論文 |