標題: Advanced TSV-Based Crystal Resonator Devices Using 3-D Integration Scheme With Hermetic Sealing
作者: Shih, Jian-Yu
Chen, Yen-Chi
Chiu, Chih-Hung
Hu, Yu-Chen
Lo, Chung-Lun
Chang, Chi-Chung
Chen, Kuan-Neng
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
關鍵字: 3-D integration;crystal resonator through-silicon via (TSV)
公開日期: 1-八月-2013
摘要: An advanced crystal resonator device scheme using Cu through-silicon via (TSV), 3-D integration, and Si packaging technologies is successfully demonstrated. In addition to robust structural quality, the crystal resonator packaging has excellent electrical characteristics of low leakage current and reliability against harsh environment for MIL-STD-883 hermetic encapsulation. Using 3-D integration technologies and Si packaging, the proposed TSV-based crystal resonator device possesses the manufacturability potential while conventional ones using a metal lid or ceramic enclosure.
URI: http://dx.doi.org/10.1109/LED.2013.2265335
http://hdl.handle.net/11536/22575
ISSN: 0741-3106
DOI: 10.1109/LED.2013.2265335
期刊: IEEE ELECTRON DEVICE LETTERS
Volume: 34
Issue: 8
起始頁: 1041
結束頁: 1043
顯示於類別:期刊論文


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