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dc.contributor.authorChang, JJen_US
dc.contributor.authorLiu, CPen_US
dc.contributor.authorHsieh, TEen_US
dc.contributor.authorWang, YLen_US
dc.date.accessioned2014-12-08T15:17:21Z-
dc.date.available2014-12-08T15:17:21Z-
dc.date.issued2006-02-24en_US
dc.identifier.issn0257-8972en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.surfcoat.2005.07.044en_US
dc.identifier.urihttp://hdl.handle.net/11536/12617-
dc.description.abstractThe role of cobalt in oxide-mediated silicidation is studied in terms of diffusion and nucleation by varying annealing conditions, oxide thickness and implantation in Si substrate. Electroscopic imaging in transmission electron microscopy shows that SiOx act as a one-way diffusion barrier reducing the Co effective concentration at the cobalt silicide growth interface leading to CoSi2 as the first formation phase during silicidation. X-ray photoelectron spectroscopy analysis shows that unreacted Co coexists with CoSi2 at the interface between the SiOx layer and Si substrate, implying that Co diffusion rate is faster than CoSi, nucleation rate. An Si-implanted substrate can increase the CoSi2 nucleation rate and reduce the Co accumulation. (c) 2005 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectcobalt silicideen_US
dc.subjectdiffusionen_US
dc.subjectnucleationen_US
dc.subjectoxide-mediated silicidationen_US
dc.titleThe study of diffusion and nucleation for COSi2 formation by oxide-mediated cobalt silicidationen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1016/j.surfcoat.2005.07.044en_US
dc.identifier.journalSURFACE & COATINGS TECHNOLOGYen_US
dc.citation.volume200en_US
dc.citation.issue10en_US
dc.citation.spage3314en_US
dc.citation.epage3318en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000235427000042-
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