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dc.contributor.authorJian, SRen_US
dc.contributor.authorFang, THen_US
dc.contributor.authorChuu, DSen_US
dc.date.accessioned2014-12-08T15:17:22Z-
dc.date.available2014-12-08T15:17:22Z-
dc.date.issued2006-02-15en_US
dc.identifier.issn0169-4332en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.apsusc.2005.05.019en_US
dc.identifier.urihttp://hdl.handle.net/11536/12625-
dc.description.abstractInxGa1-x thin films with In concentration ranging from 25 to 34 at.% were deposited on sapphire substrate by metal-organic chemical vapor deposition (MOCVD). Crystalline structure and surface morphology of the deposited films were studied by using X-ray diffraction (XRD) and atomic force microscopy (AFM). Hardness, Young's modulus and creep resistance were measured using a nanoindenter. Among the deposited films, In0.25Ga0.75N film exhibits a larger grain size and a higher surface roughness. Results indicate that hardness decreases slightly with increasing In concentration in the InxGa1-xN films ranged from 16.6 +/- 1.1 to 16.1 +/- 0.7 GPa and, Young's modulus for the In0.25Ga0.75N, In0.3Ga0.7N and In0.34Ga0.66N films are 375.8 +/- 23.1, 322.4 +/- 13.5 and 373.9 +/- 28.6 GPa, respectively. In addition, the time-dependent nanoindentation creep experiments are presented in this article. (c) 2005 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectInGaNen_US
dc.subjectXRDen_US
dc.subjectAFMen_US
dc.subjectnanoindentationen_US
dc.subjectcreepen_US
dc.titleNanomechanical characterizations of InGaN thin filmsen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.apsusc.2005.05.019en_US
dc.identifier.journalAPPLIED SURFACE SCIENCEen_US
dc.citation.volume252en_US
dc.citation.issue8en_US
dc.citation.spage3033en_US
dc.citation.epage3042en_US
dc.contributor.department電子物理學系zh_TW
dc.contributor.departmentDepartment of Electrophysicsen_US
dc.identifier.wosnumberWOS:000235721800046-
dc.citation.woscount22-
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