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dc.contributor.authorKer, MDen_US
dc.contributor.authorKuo, BJen_US
dc.contributor.authorHsiao, YWen_US
dc.date.accessioned2014-12-08T15:17:26Z-
dc.date.available2014-12-08T15:17:26Z-
dc.date.issued2006-02-01en_US
dc.identifier.issn0304-3886en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.elstat.2005.03.086en_US
dc.identifier.urihttp://hdl.handle.net/11536/12647-
dc.description.abstractLarge electrostatic discharge (ESD) protection devices close to the I/O pins, beneficial for ESD protection, have an adverse effect on the performance of broadband radio-frequency (RF) circuits for impedance mismatch and bandwidth degradation. A new proposed ESD protection structure, pi-model distributed ESD (pi-DESD) protection circuit, composed of one pair of ESD devices near the I/O pin, the other pair close to the core circuit, and a coplanar waveguide with under-grounded shield (CPWG) connecting these two pairs, can successfully achieve both excellent ESD robustness and good broadband RF performance. Cooperating with the active power-rail ESD clamp circuit, the experimental chip in a 0.25-mu m CMOS process can sustain the human-body-model (HBM) ESD stress of 8 kV. (c) 2005 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectbroadbanden_US
dc.subjectdistributeden_US
dc.subjectESDen_US
dc.subjectprotectionen_US
dc.subjectschemeen_US
dc.titleOptimization of broadband RF performance and ESD robustness by pi-model distributed ESD protection schemeen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.doi10.1016/j.elstat.2005.03.086en_US
dc.identifier.journalJOURNAL OF ELECTROSTATICSen_US
dc.citation.volume64en_US
dc.citation.issue2en_US
dc.citation.spage80en_US
dc.citation.epage87en_US
dc.contributor.department電機學院zh_TW
dc.contributor.departmentCollege of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000234159200003-
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