Full metadata record
DC FieldValueLanguage
dc.contributor.authorKao, YLen_US
dc.contributor.authorTu, GCen_US
dc.contributor.authorHuang, CAen_US
dc.date.accessioned2014-12-08T15:17:31Z-
dc.date.available2014-12-08T15:17:31Z-
dc.date.issued2006-02-01en_US
dc.identifier.issn0010-938Xen_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.corsci.2005.01.005en_US
dc.identifier.urihttp://hdl.handle.net/11536/12691-
dc.description.abstractThe anodic polarization and a.c. impedance measurements of 4 nm- and 25 nm-zinc-electroplated copper specimens were conducted in aqueous solutions with four different pH-values. The nano-thick zinc-electroplated copper was tested after electroplating and annealing at 180 degrees C for 1, 2 and 3 h, respectively. The results showed that the open-circuit potential (OCP) of 25 nm-zinc electroplated copper shifted toward noble potential after annealing. A more noble OCP of 25 nm zinc-electroplated copper could be achieved when zinc plated copper was annealed at 180 degrees C up to 1 h. Similar change was found for 4 nm-zinc electroplated copper only in neutral and alkaline solutions. The a.c. impedance response of all nano-thick zinc-electroplated copper corresponded to two Randle's circuits in series, in which the circuit measured in a high frequency region of their Nyquist diagrams revealed the electrochemical behavior of nano-thick zinc deposits. The charge transfer resistance of the nano-thick zinc electroplated copper was significantly raised after annealing at 180 degrees C when tested in pH 9.5 solution. Microstructures of the aforementioned nano-thick zinc electroplated copper were examined with cross-sectional TEM specimens. A distinct phase interface between zinc and copper was observed for as plated specimens, while alloying of zinc and copper at the interface was detected after annealing at 180 degrees C for 1 h. Electroplated zinc diffused into the copper foil during the 180 degrees C-annealing and the corrosion potential of the anodic polarization curve indicated the condition of the alloy surface. The annealing effect of 4 nm- and 25 nm-zinc eleetro-plated copper specimens could be related to the results of electrochemical measurement. (C) 2005 Elsevier Ltd. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectnano-thick filmen_US
dc.subjectzinc-electroplated copperen_US
dc.subjectannealingen_US
dc.subjectanodic polarizationen_US
dc.subjectopen circuit potentialen_US
dc.subjectAC impedanceen_US
dc.subjectHRTEMen_US
dc.titleThe effect of 180 degrees C-annealing on the electrochemical behavior of nano-thick zinc-electroplated copper in aqueous solutions with different pHen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.corsci.2005.01.005en_US
dc.identifier.journalCORROSION SCIENCEen_US
dc.citation.volume48en_US
dc.citation.issue2en_US
dc.citation.spage420en_US
dc.citation.epage431en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000235462500010-
dc.citation.woscount0-
Appears in Collections:Articles


Files in This Item:

  1. 000235462500010.pdf

If it is a zip file, please download the file and unzip it, then open index.html in a browser to view the full text content.