完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | 鄧薇蓁 | en_US |
dc.contributor.author | Ten,Wei-Chen | en_US |
dc.contributor.author | 吳耀銓 | en_US |
dc.contributor.author | Wu, Yew-Chung-Sermon | en_US |
dc.date.accessioned | 2015-11-26T01:02:09Z | - |
dc.date.available | 2015-11-26T01:02:09Z | - |
dc.date.issued | 2015 | en_US |
dc.identifier.uri | http://140.113.39.130/cdrfb3/record/nctu/#GT070161317 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/127216 | - |
dc.language.iso | zh_TW | en_US |
dc.subject | 熱模擬 | zh_TW |
dc.subject | 熱管理 | zh_TW |
dc.subject | 高功率元件熱管理 | zh_TW |
dc.subject | ANSY熱模擬 | zh_TW |
dc.subject | 單層鑽石銅複合材料 | zh_TW |
dc.subject | 鑽石複合材料熱阻 | zh_TW |
dc.subject | 散熱基板 | zh_TW |
dc.subject | 鑽石複合材料熱傳導係數 | zh_TW |
dc.subject | Thermal Simulation | en_US |
dc.subject | ANSYS | en_US |
dc.subject | theraml management | en_US |
dc.subject | Monolayer-Diamond-Cu Composite | en_US |
dc.subject | thermal conductivity | en_US |
dc.subject | thermal resistance | en_US |
dc.subject | Thermal management of high power devices | en_US |
dc.subject | Heat radiation substrate | en_US |
dc.title | 利用單層鑽石銅複合材料應用在高功率元件之熱管理 | zh_TW |
dc.title | Thermal Management in High Power Device by using Monolayer-Diamond-Cu Composite | en_US |
dc.type | Thesis | en_US |
dc.contributor.department | 工學院半導體材料與製程設備學程 | zh_TW |
顯示於類別: | 畢業論文 |