完整後設資料紀錄
DC 欄位語言
dc.contributor.authorTsai, JLen_US
dc.contributor.authorKuo, JCen_US
dc.contributor.authorHsu, SMen_US
dc.date.accessioned2014-12-08T15:17:37Z-
dc.date.available2014-12-08T15:17:37Z-
dc.date.issued2006en_US
dc.identifier.isbn0-87849-990-3en_US
dc.identifier.issn0255-5476en_US
dc.identifier.urihttp://hdl.handle.net/11536/12779-
dc.description.abstractThis research is aimed to fabricate glass fiber/epoxy nanocomposites containing organoclay as well as to understand the organoclay effect on the in-plane shear strength of the nanocomposites. To demonstrate the organoclay effect, three different loadings of organoclay, were dispersed in the epoxy resin using mechanical mixer followed by sonication. The corresponding glass/epoxy nanocomposites were prepared by impregnating the organoclay epoxy mixture into the dry glass fiber through a vacuum hand lay-up process. Off-axis block glass/epoxy nanocomposites were tested in compression to produce in-plane shear failure. It is noted only the specimens showing in-plane shear failure mode were concerned in this study. Through coordinate transformation law, the uniaxial failure stresses were then converted to a plot of shear stress versus transverse normal stress from which the in-plane shear strength was obtained. Experimental results showed that the fiber/epoxy nanocomposite exhibit higher in-plane shear strength than the conventional composites. This increased property could be ascribed to the enhanced fiber/matrix adhesion promoted by the organoclay.en_US
dc.language.isoen_USen_US
dc.subjectorganoclayen_US
dc.subjectglass/epoxy nanocompositesen_US
dc.subjectin-plane shear strengthen_US
dc.subjectmechanical propertiesen_US
dc.titleFabrication and mechanical properties of glass fiber/epoxy nanocompositesen_US
dc.typeArticle; Proceedings Paperen_US
dc.identifier.journalPROGRESS ON ADVANCED MANUFACTURE FOR MICRO/NANO TECHNOLOGY 2005, PT 1 AND 2en_US
dc.citation.volume505-507en_US
dc.citation.spage37en_US
dc.citation.epage42en_US
dc.contributor.department機械工程學系zh_TW
dc.contributor.departmentDepartment of Mechanical Engineeringen_US
dc.identifier.wosnumberWOS:000235279200007-
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