完整後設資料紀錄
DC 欄位語言
dc.contributor.authorChiu, Kim-Anen_US
dc.contributor.authorWu, Ping-Hsunen_US
dc.contributor.authorPeng, Chun-Yenen_US
dc.contributor.authorTian, Jr-Shengen_US
dc.contributor.authorChang, Lien_US
dc.date.accessioned2015-12-02T02:59:06Z-
dc.date.available2015-12-02T02:59:06Z-
dc.date.issued2015-08-01en_US
dc.identifier.issn0042-207Xen_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.vacuum.2015.01.013en_US
dc.identifier.urihttp://hdl.handle.net/11536/127855-
dc.description.abstractThe internal stress in high-quality (111) homoepitaxial diamond film grown on high-pressure high temperature (HPHT) synthesized single crystal diamond substrate by chemical vapor deposition (CVD) can be reduced effectively by embedding Au islands in diamond. Au islands formed from an Au layer deposited on the diamond substrate by electron beam evaporation can be obtained after hydrogen plasma annealing. Transmission electron microscopy and X-ray diffraction results show that the Au islands covered with CVD diamond have a size in a few hundreds of nanometers and are oriented with diamond in the orientation relationship of {111}Au//{111}(Dia) and < 110 > Au//< 110 > Dia. The surfaces of the CVD diamond films grown on substrate with and without Au coating exhibit cracks when the film thickness reaches 3.5 mu m. As evaluated from the Raman peak shift, it is shown that the internal tensile stress in the film with Au islands is less than in the same thick film on substrate without Au coating. A crack-free (111) homoepitaxial diamond film in the same thickness can be obtained by insertion of multilayers of Au islands in CVD diamond. (c) 2015 Elsevier Ltd. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectHomoepitaxial growthen_US
dc.subjectDiamonden_US
dc.subjectGolden_US
dc.subjectMicrowave plasma chemical vapor depositionen_US
dc.subjectStressen_US
dc.titleHomoepitaxial growth and stress analysis of (111) diamond film with embedded gold islandsen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.vacuum.2015.01.013en_US
dc.identifier.journalVACUUMen_US
dc.citation.volume118en_US
dc.citation.spage104en_US
dc.citation.epage108en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000356190500021en_US
dc.citation.woscount0en_US
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