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dc.contributor.authorHsu, Hsiao-Hsuanen_US
dc.contributor.authorChiu, Yu-Chienen_US
dc.contributor.authorChiou, Pingen_US
dc.contributor.authorCheng, Chun-Huen_US
dc.date.accessioned2015-12-02T02:59:15Z-
dc.date.available2015-12-02T02:59:15Z-
dc.date.issued2015-09-15en_US
dc.identifier.issn0925-8388en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.jallcom.2014.12.061en_US
dc.identifier.urihttp://hdl.handle.net/11536/127976-
dc.description.abstractIn this works, we investigated a Ti-O material system integrating with InGaZnO thin film transistor. The Ti-O material system with high bond enthalpy can be functionalized by tuning the amount oxygen vacancies to reach the applicable requirements of gate dielectric and channel. Compared to control IGZO TFTs, the flexible TiOx/IGZO TFT reaches a smaller sub-threshold swing (SS) of 125 mV/decade and a higher field effect mobility of 61 cm(2)/V s at a very low operating voltage of 1.5 V. Besides, only slight performance degradation was found after bending test. (C) 2014 Elsevier B.V. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectThin film transistoren_US
dc.subjectTitanium oxideen_US
dc.subjectInGaZnOen_US
dc.subjectFlexible electronicsen_US
dc.titleImprovement of dielectric flexibility and electrical properties of mechanically flexible thin film devices using titanium oxide materials fabricated at a very low temperature of 100 degrees Cen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.jallcom.2014.12.061en_US
dc.identifier.journalJOURNAL OF ALLOYS AND COMPOUNDSen_US
dc.citation.volume643en_US
dc.citation.spageS133en_US
dc.citation.epageS136en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000357903400025en_US
dc.citation.woscount0en_US
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